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Management - Leuven | More than two weeks ago Advanced packaging is reshaping how complex semiconductor systems are designed and manufactured. At IC-Link by imec, you will lead the integration of technologies such as silicon interposers, fine-pitch microbumps, redistribution layers, through-silicon vias and advanced bonding technologies into a coherent platform for prototyping and manufacturing. You will work at the…

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Advanced 3D Packaging Integration Lead

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