Modelisation of light matter interaction for temporary bonding applications — imec | SciFind

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Administrative / Other🇧🇪 BelgiumNo deadline

imec

Modelisation of light matter interaction for temporary bonding applications

🇧🇪 Leuven

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Master internship - Leuven | More than two weeks ago As the semiconductor industry shifts toward advanced system‑level integration, temporary wafer bonding and debonding has become essential for handling thin wafers and complex packaging flows. This internship focuses on improving a technique that enables the use of standard Si wafers as temporary carriers, offering a low‑cost and process‑friendly solution. The main…

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Modelisation of light matter interaction for temporary bonding applications

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