Reliability of 3D advanced technologies: the hybrid-bonding interface. — imec | SciFind

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Administrative / Other🇧🇪 BelgiumNo deadline

imec

Reliability of 3D advanced technologies: the hybrid-bonding interface.

🇧🇪 Leuven

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Master internship - Leuven | About a week ago Join imec, one of the world’s premier research centers in nanotechnology, at its headquarters in Leuven, Belgium, to study the reliability of the most advanced 3D technology: wafer to wafer hybrid-bonding. Understanding the reliability of the SiCN wafer-to-wafer interface is key in assessing the reliability of this technology. As the traditional more Moore approach is slo…

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Reliability of 3D advanced technologies: the hybrid-bonding interface.

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