imec · Management - Leuven
Administrative / Other
Advanced 3D Packaging Integration Lead
Management - Leuven | More than two weeks ago Advanced packaging is reshaping how complex semiconductor systems are designed and manufactured. At IC-Link by imec, you will lead the integration of technologies such as silicon interposers, fine-pitch microbumps, redistribution layers, through-silicon vias and advanced bonding technologies into a coherent platform for prototyping and manufacturing. You will work at the intersection of technology development, semiconductor manufacturing, design enablement and the global packaging supply chain. Your goal will be clear: make imec's originated…
🇧🇪 LeuvenPermanent
No deadlineSource: imec