BA/MA: "Simulation Model for Optimization of Thermal Expansion in Embossing Contact"

Here you create change In thermal embossing, a microstructure is transferred onto thermoplastic substrates through forming. The associated heating and cooling cycles lead to transient thermal expansion in the stamp and substrate, which in turn reduces the molding quality. In the context of this thesis, it should be investigated whether shear stresses in the embossing contact can be reduced through intelligent combina…