Fraunhofer ENAS · ENAS - Electronic Nano Systems
Student / Thesis
Master's Thesis: Modeling and Simulation of Wafer Bonding Process
The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes. Wafer bonding is a critical process in semiconductor manufacturing,…
🇩🇪 Chemnitz
No deadlineSource: Fraunhofer ENAS