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Master's Thesis: Modeling and Simulation of Wafer Bonding Process — Fraunhofer ENAS | SciFind

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Student / Thesis🇩🇪 GermanyNo deadline

Master's Thesis: Modeling and Simulation of Wafer Bonding Process

Fraunhofer ENAS

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About this position

The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via d…

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Position Details

Institution

Fraunhofer ENAS

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