Bachelor's/Master's Thesis: A comparative study of sinter pastes & preforms for inductive sintering
The department System Packaging focuses on innovative packaging technologies for microelectronics and power electronics. The main emphasis lies on the development of reliable interconnection and bonding techniques that meet increasing demands in thermal and mechanical stability. In the context of electromobility and other high- tech applications, we investigate new approaches for using copper as a cost-efficient and high-performance material in packaging solutions. The increasing demand for compact and reliable power electronic systems drives the development of advanced die-attach…
